Resin bonded ultra-thin diamond dicing blades are mainly used for semicinductor, optical glass, quartz glass, ceramincs ect.
Resin bond diamond dicing blades for semicinductor component(QFN, PQFN), which can avoid burrs, and improve efficiency and life.
Resin bond diamond dicing blades for optical glass, which can avoid chios and improve yield.
Resin bond diamond dicing blades for quartz glass, which can avoid chios and improve efficiency, and finish of product.
Resin bond diamond dicing blades for ceramics, which can avoid chips and cracks, and improve the processing quality.
Other material, such as slotting and cutting of crystal, magnetic materials, carbide and some other difficult to cut metal materials with excellent cutting quality .
Type of Resin bonded ultra-thin diamond dicing blades
The models of diamond dicing blades divide into 1A8/1 type without water slot and 1A8/2 type with water slot.
Specification of ultra-thin diamond dicing blades（mm）
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Other specification can be made according to customers requirements. Email: email@example.com